Nowadays in SMT industry, electronic devices are expected to be compact, light-weight, and highly functional, which necessitates a printing technology that is compatible with fine-
Nowadays in SMT industry, electronic devices are expected to be compact, light-weight, and highly functional, which necessitates a printing technology that is compatible with fine-
Since the Waste Electrical and Elec- tronic Equipment (WEEE) and the Restrictions on the use of Haz- ardous Substances (RoHS) direc- tives came into effect in July 2006, the use of
ABSTRACTOver the last few years, there has been an increase in the use of component parts such as QFNs and Power Transistors which have large solder paste contact areas underneath
Abstract Over the last few years, there has been an increase in the rate of Head-in-Pillow component soldering defects which interrupts the merger of the BGA/CSP compo
Until last year, solders have been seriously affected by the high cost of metal materials. At present, the SAC305 (Sn-3mass%Ag-0.5mass%Cu) is the mainstream lead-free solder. Its c
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