Koki awarded an encouragement award at Mate 2017

Koki would like to proudly announce that our co-written technical paper with Origin Electric, “Development of Solder Paste for Vacuum Reflow Using Formic Acid”, has been awarded an encouragement award by the Japan Welding Society at Mate 2017, “23rd Symposium on Microjoining and Assembly Technology in Electronics”, held on January 31st and February 1st 2017.

We are honoured to receive this award, and will take this as a great opportunity to reaffirm our pledge to continue developing new and valuable technologies and products for the advancement of the electronics industry.

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