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New High Performance Solder Paste without Restraints from Reflow Profile

Highly balanced performance in void reduction and printability/ wettability improvement for versatile application

KOKI Company Limited (Tokyo, Japan) is announcing a newly developed general application solder paste with highly balanced SMT performances: S3X58-G801

In today’s manufacturing environment, a totally balanced high performance solder paste with features like high wetting, ultra-low solder balling and low voiding, is required. At the same time, more emphasis is to achieve the stable printing process so, it is very vital to have a stable viscosity and reusability of the solder paste the next day.

The newly developed solder paste S3X58-G801 is engineered with a highly heat-resistant flux that stays inactive at the ambient temperature, thereby ensuring stable viscosity of the solder paste on the shelf and during continuous printing. Heat-resistant feature of S3X58-G801 effectively prevents heat-slump and eliminates the occurrence of solder balls. Furthermore, the solder paste achieves low voiding as the newly engineered and improved fluidity of the flux which reduces the generation of gas during the reduction reaction.

S3X58-G801 is a “Process-Friendly”, “Drop-In Replacement” solder paste that reduces the hassle of changing the material and provides with higher quality solder joints.

Click here to view product information on"S3X58-G801"


Product features

  1. Reduces void occurrence regardless of component type or reflow profile
    S3X58-G801 reduces the generation of gases from burning of flux during reflow thereby reducing the voids in the solder joint. Furthermore, the flux is designed so that the gases are released easily to achieve an ultra-low void solder joint.
  2. Retains the print geometry , higher first pass yield
    S3X58-G801 retains the defined printed solder shape due to the use of special resin and shape-retaining agent in the solder flux. Stable printed solder shape results in higher first pass yield at the SPI.
  3. Good wetting performance to a wide range of materials
    S3X58-G801 adopts carefully chosen flux ingredients to effectively reduce oxide film on various plating materials. It also assures good wetting ability to most substrates and high reliability flux residue after soldering.

S3X58-G801 Solder Paste

Void Evaluation: 6330 Chip (L) and BGA (R)

Product features

  • Product Name : S3X58-G801
  • Alloy Composition : Sn 3.0Ag 0.5Cu
  • Melting Point : 217-219
  • Flux Designation : ROL0 * In accordance with IPC J-STD-004
  • Solder Powder Grain Size(μm) : 20-38

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