Low Ag containing, SAC305 profile applicable solder paste

S1XBIG58-M650-7
Sn 1.1Ag 0.7Cu 1.8Bi+Ni

Testing Probe Stays Clean.

High ICT first pass yield

S1XBIG58-M650-7 prevents the buildup of thick and sticky flux residue over the solder joint,
which helps the testing probe to get the accurate readings to improve the first pass rate.

■ Resistance between Probe and PCB

Superior wetting ability prevents voiding

For smaller components such as QFNs, micro BGA and LGA, bigger voids could occupy majority of the pad area thus creating a possible weak link for failure. S1XBIG58-M650-7 has specially designed flux to effectively reduce the amount of gas generated thereby minimize the amount of voids.

■ Solder joint diagram (After 1500 cycles of -30 +/-80℃)

"Halogen-free"
addressing the environment

One keyword of environmental measures is "halogen-free"; these days companies demand final products to be halogen-free.
Halogen-free S1XBIG58-M650-7 meets such demands while providing both reliability and workability.

Product Performance Table

Product Name
S1XBIG58-M650-7
Product Category
Solder Paste
Composition
Sn 1.1Ag 0.7Cu 1.8Bi+Ni
Melting Point(℃)
211-223
Particle Size（μm）
20-38
Viscosity（Pa.s）
200
Flux Content(%)
11.2
Halide content(%)
0
Flux Type
ROL0

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