Dispensing solder paste for super find pitch and micro components

S3X70-M500D
Sn 3.0Ag 0.5Cu

Solder the right "Spot".Not "Area" soldering.

Uniformly spherical solder powder

The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-M500D minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability.

■Solder Powder

Consistent deposit shape even in long-term uses

Carefully selected solder powder and flux of highly consistent viscosity in continual use maintain fine print shapes even in long-term uses.

■Print Definition (φ300μm)

Superbly low voiding for any component

S3X70-M500D is designed to maintain its activity for a long period of time. During reflow, by removing voids in a long span, S3X70-M500D realizes low voiding for any component.

■X-ray image

Product Performance Table

Product Name
S3X70-M500D
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217-219
Particle Size(μm)
10-25
Viscosity(Pa.s)
100
Flux Content(%)
14.0
Halide content(%)
0
Flux Type
ROL0 (IPC J-STD-004A)
Characteristics
Application:Dispensing

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