Non-contact jet dispensing applicable solder paste

E150DN series
Sn 3.0Ag 0.5Cu

"JET" brings about various advantages

Consistently Deposited Solder

Non-contact application of solder paste allows repeated deposition to one specific spot. Amount of solder paste is adjustable according to the size of components, thus securing high reliability at the solder joint.

Stable Solder Paste Shape

Configuration of dispensed solder paste is stable all the way through in jet dispensing, as the process does not involve a nozzle contact which is responsible for causing bridges.

Achieves High Precision Dispensing

E150DN Series wipes out concerns with jet dispensing of solder paste such as clogging of needles, solder icicle, and spattering by optimizing size of solder powder and viscosity, and adjusting thixotropy.

Product Performance Table

Product Name
E150DN series
Product Category
Solder Paste
Melting Point(℃)
217-219
Particle Size（μm）
58:20-38 / 70:10-25 / 811:5-20
Viscosity（Pa.s）
40
Flux Content(%)
15.0
Halide content(%)
0
Flux Type
ROL0 (IPC J-STD-004A)

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