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High Performance Halogen Free Lead Free Solder Paste
S3X58-HF920
Sn 3.0Ag 0.5Cu
Superior Wetting Despite Halogen Free Flux Chemistry
Activator Technique
In conventional solder paste, activator reacts with the solder powder at room temperature (during the storage) and increases the viscosity of solder paste.Activator in S3X58-HF920 is selected in such a way that it does not react with solder powder at room temperature but activates at elevated temperatures during the reflow process to get superior wetting. As a result, S3X58-HF920 obtains superior wetting ability but the viscosity of the solder paste is not compromised.
Viscosity Stability in Storage
Viscosity and Ti values were found to remain stable for a month’s storage at two different temperatures: 1. below 10°C and 2. at 30°C.
High Electrical Reliability
Insulation Resistance Test
Product Performance Table
- Product Name
- S3X58-HF920
- Product Category
- Solder Paste
- Composition
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- 217-219
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 200±20
- Flux Content(%)
- 11.5±1.0
- Halide content(%)
- 0
- Flux Type
- ROL0(IPC J-STD-004B)
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