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- S3X58-M500C-7
Upgraded Powerful Wetting General Purpose Solder Paste
S3X58-M500C-7
Sn 3.0Ag 0.5Cu
Good and Consistent Wetting
Spreading to Oxidized Metal Surface.
Activator Technique
After removal of oxide film at pre-heating stage, a new protective film formed on the surface of solder particles to effectively prevent re-oxidation during the remaining heating process thereby results in powerful wetting/melting.
Low Voiding Technique
Solder Spreading Property
After continual print, pause 45 min. or 60 min. and resume printing and observe print volume.
Test condition
・ Stencil : 200μm / 6.5mmφ aperture
・ Pre-conditioning : 150ºC for 16Hr
・ Heat source : Convection reflow
・ Reflow : Air
Product Performance Table
- Product Name
- S3X58-M500C-7
- Product Category
- Solder Paste
- Composition
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- 217-219
- Particle Size(μm)
- 20-38
- Viscosity(Pa.s)
- 200
- Flux Content(%)
- 11.8
- Halide content(%)
- 0
- Flux Type
- ROL0 (IPC J-STD-004)
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