Anti-pillow and powerful wetting solder paste

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S3X58-M500C-5

Sn 3.0Ag 0.5Cutype3type4
Unprecedented
"Powerwet".

Cleans off stubborn oxide films

Among various substrates and components used in recent years, some plating types, conditions and materials can be in a degraded condition. The powerful wettability of S3X58-M500C-5 ensures good assembly even for oxidized substrates and degraded components.

Significantly reduces BGA solder defects

The "head-in-pillow" defects in BGA assemblies are caused by warping of BGA packages or oxidation of bumps due to heat during reflow. By improving wetting speed and thermal tolerance of flux, the occurrence rate of such defects is significantly reduced, thereby improving first run rate.

Less voids for higher joint reliability

Newly adopted flux resin and additives exert their functions to significantly reduce voids that often occur for large components such as power transistors. Thus the feature helps to achieve high assembly quality and high product reliability.

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