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- Investigation and development of tin-lead and lead-free solder pastes to reduce the head-in-pillow component soldering defect
Investigation and development of tin-lead and lead-free solder pastes to reduce the head-in-pillow component soldering defect
2014.12.21
Abstract
Over the last few years, there has been an increase in the
rate of Head-in-Pillow component soldering defects which
interrupts the merger of the BGA/CSP component solder
spheres with the molten solder paste during reflow. The
issue has occurred across a broad segment of industries
including consumer, telecom, and military.
There are many reasons for this issue such as warpage issues of the
component or board, ball co-planarity issues for BGA/CSP
components, and non-wetting of the component based on
contamination or excessive oxidation of the component
coating. The issue has been found to occur not only on lead-free
soldered assemblies where the increased soldering
temperatures may give rise to increase component/board
warpage but also on tin-lead soldered assemblies.
In order to reduce this affect, work was done on a set of tin-lead
and lead-free solder pastes which were developed with
flux formulations in the solder paste having higher heat
resistance which did not lose their flux activation properties
as quickly and quicker wetting which helped to reduce the
head-in-pillow defect. The results of the evaluation are
presented with test methods to analyze the head in pillow
defect not only on BGA components.
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