Close of Special Feature Articles

2020.7.9

In response to a sudden increase of remote work worldwide, Koki had introduced and shared a series of special feature

articles on soldering weekly from April through the beginning of July in 2020.

Headings of the featured articles are as follows:

1. De-wetting - Inferior Plating Quality

2. De-wetting - Contaminated Plating

3. De-wetting - Foreign Object Debris

4. De-wetting - Damaged Plating

5. De-wetting - Improper Condition Setting

6. Voids in Solder Joint - Effect of Reflow Atmosphere

7. Voids in Solder Joint - Reflow profile type (linear vs. saddle)

8. Voids in Solder Joint - Preheat Effect in Saddle Reflow Profile

9. Voids in Solder Joint - Effect of Oxidation of PCB Land Surface

10. Voids in Solder Joint - Poor-Quality Components

11. Voids in Solder Joint - Effect of the Stencil Aperture Pattern Shape

12. Voids in Solder Joint - Voids near Solder Joint Interface

13. Voids in Solder Joint - Voids in Micro Via Holes

14. Voids in Solder Joint - Pin Holes and Blow Holes, Examples and Causes

Having accomplished our original intent, we closed the web pages on July 8, 2020.

If you wish to read any of the above full-text articles, please send us a request from "Inquiry Form" on this site.

Our apologies for the inconvenience.

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