• HOME > 
  • Technical Memo > 
  • Melting Behaviour versus Different Types of Lead Free BGAs

Melting Behaviour versus Different Types of Lead Free BGAs

2012.12.10

Design of reflow thermal profiles are very dependant on the components mounted on the board, and this specific application investigates the issue where two types of very commonly available BGA packages are mounted on the same assembly.


To read the full text of this article, please send a request from the “Form” button below.

You have question?

Inquiry Form