Thank you for visiting us at 48th INTERNEPCON JAPAN
We thank you for your coming by our booth, and/or getting interested in our latest products at 48th INTERNEPCON JAPAN held from January 16 through 18, 2019 at Tokyo Big Sight.
Advanced low void solder paste, S3X58-G803, and high reliability alloy halogen free solder paste, SB6NX58-HF350, both new and will be officially released shortly, attracted a high level of interest among others at the exhibition.
If you were unable to come but wish for a new products catalog, please send us a request via the inquiry form.