High durability alloy solder paste

SB6N58-M500SI
Sn 3.5Ag 0.5Bi 6.0ln

Catalog

Highly thermal stress resistant alloy with indium

Increasing demand for high thermal stress durability

For PCBs exposed to severe temperature fluctuation, long term durable alloys are required to counter thermal cycling induced stress.

■ Mechanism of crack occurrence by thermal cycling stress

Absorption of mechanical stress by addition of indium

SB6N58 M500S1 adopted 6% indium to balance and optimize thermal stress and deformation character̶ istics, which could occur if excessively added.

■ Difference of deformation temperature by Indium content

Remarkable joint reliability

■ Shear strength ( 40⇔ 150°C for 30min. each) & Cross sectional view (After 1500 cycles)

Product Performance Table

Product Name
SB6N58-M500SI
Product Category
Solder Paste
Composition
Sn 3.5Ag 0.5Bi 6.0ln
Melting Point(℃)
202-210
Particle Size（μm）
20-38
Viscosity（Pa.s）
200 / 120
Flux Content(%)
11.1 / 13.0
Halide content(%)
0
Flux Type
ROL0
Characteristics
for Dispense : SB6N58-M500SID

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