True Halogen-free High Performance Solder Paste

S3X58-HF1000
Sn 3.0Ag 0.5Cu

Excellent wetting
and printability
despite being halogen free

Powerful solderability with various metal finishes

S3X58-HF1000 exhibits good solder spreading and wetting performance regardless of the type and condition of the metal finish as the activation property design is optimized.

Stable print shape and paste transfer ratio

Stable printing is observed at 0.25mmφ CSP and 0.4mm QFP using S3X58-HF1000.
The solder paste also maintains good paste transfer rate when printing is resumed after being left idle for 60 minutes.

【Intermittent Printability】

High heat resistant formulation

Thanks to the developed stabilizer technology, S3X58-HF1000 retains ample activation strength at high temperatures and exhibits high head-on-pillow resistance.

Product Performance Table

Product Name
S3X58-HF1000
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217 - 219
Particle Size(μm)
20 - 38
Viscosity(Pa.s)
220 ± 30
Flux Content(%)
12.0
Halide content(%)
0
Flux Type
ROL0(IPC J-STD-004B)

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