Micro-pattern Application Halogen Free Solder Paste

Sn 3.0Ag 0.5Cu

Applicable to 0402 chip component
with AIR reflow atmosphere.

Reduces defects during stencil printing
with a newly developed lubrication technique

S3X70-G835 adopts a type of non-volatile solvent as its primary constituent,
and can keep itself from drying when the paste is left idle.
A better print-to-pause property results,
ensuring a consistent printability and workability even after a 60-min. pause.

[ Print-to-pause property ]
Evaluate transfer rate of printed solder paste volume before and after leaving on a stencil.
・Substrate: FR-4 ・Stencil thickness: 0.08mm (laser cut)
・Stencil aperture: 0.18mm dia. Pattern ・Squeegee angle: 60°

Excellent meltability and wettability
on micro-patterns in air reflow

Although the size of the S3X70-G835 solder particle is Type 5,
the product exhibits good meltability and wettability without a Nitrogen atmosphere.
This has been enabled by a newly engineered flux formulation optimized for Type 5 powders.

[ Reflow test in Air atmosphere ]
・Substrate: FR-4 ・Stencil thickness: 0.08mm
・Stencil aperture: 0.175mm dia. , 0402R
・Aperture ratio: 100% ・Pad surface finish: Cu-OSP
・Heating method: Hot air reflow ・Reflow atmosphere: Air

Reduced voids with various board surface
finish treatments

In addition to having good melting properties,
S3X70-G835 displays excellent wetting performance on various board surface finishes.
This helps the molten solder to quickly push out flux elements,
and reduces the occurrence of voids as a result.

Product Performance Table

Product Name
Product Category
Solder Paste
Sn 3.0Ag 0.5Cu
Melting Point(℃)
Particle Size(μm)
200 ± 30
Flux Content(%)
12.0 ± 1.0
Halide content(%)
Flux Type

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