REACH compliant SMT adhesive for dispensing

JU-110-3

Applicable to 1005 chip components

Stable and tall deposits ensure contact even with 1005 chip components

JU-110-3 ensures excellent shape retention, enabling continual application of tall print deposits.
Therefore, contact with surface-mounted components of any shape is achieved,
improving reliability of the wave soldering process.

Resistant to heat slump

JU-110-3 is resistant against heat slump, maintaining the height of deposits throughout the process.
The height of deposits and contact with surface-mounted components are maintained even during heating,
securely holding the components in place.

Compliant to REACH regulation

JU-110-3 has significantly reduced the content of one of the substances of very high concern (SVHC) as regulated by the European Chemical Agency (ECHA), and is compliant to the REACH regulation.

Product Performance Table

Product Name
JU-110-3
Product Category
Heat Curable SMT Adhesive
State / Color
Paste, red
Tg（℃）
90
Curing condition
130ºC, >60sec.
Shelf life (0-10℃)
6 months

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