Halogen-free solder paste applicable to 0402 metric in air reflow
KOKI Company Limited announces the release of a newly developed halogen free solder paste for micro-pattern application S3X70-G811, that can be reflowed in an air atmosphere.
S3X70-G811 adopts a newly engineered flux formulation optimized for Type 5 solder powder and enables air reflow soldering of 0402 metric size components with the following product features:
- Excellent meltability and wettability at the micro-patterns in air reflow
Although the solder paste size of S3X70-G811 is Type 5, the product exhibits good meltability and wettability without a Nitrogen atmosphere. This has been enabled by a newly engineered flux formulation optimized for Type 5 powders.
- Reduced stencil issues with the newly developed lubrication technique
S3X70-G811 adopts a type of non-volatile solvent as its primary constituent and can keep itself from drying when the paste is left idle. A better print-to-pause property results, ensuring a consistent printability and workability even after a 60-min. pause.
- Reduced voids with various board surface finish treatments
In addition to having good melting properties, S3X70-G811 displays excellent wetting performance on various board surface finishes. This helps the molten solder to quickly push out flux elements and reduces the occurrence of voids as a result.