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- S1XBIG58-HF1100-3
S1XBIG58-HF1100-3
Sn 1.1Ag 0.7Cu 1.8Bi + Ni
Achieved joint reliability
superior to SAC305
Maintains thermal-fatigue resistance over a long duration
【 Strengthening by fine precipitates: Ni 】
Strengthening method by preventing the Sn crystal grain structure from coarsening
by forming fine precipitates of high melting point intermetallic compounds
which prevent dislocations from propagating beyond the grain boundaries.
【 Strengthening by solid solution: Bi 】
Bi, which has larger atomic diameter than Sn is scattered in the Sn lattice and forms distortions
within the matrix to prevent the propagation and accumulation of the dislocation.
Sn crystal grain structure is strengthened by partially replacing the Sn atoms with Bi atoms and helps
to resist deformation by preventing the dislocations from propagating.
S1XBIG achieves less strength loss against thermomechanical stress and
prevents deformation of the joint structure and growth of coarse IMC compared with SAC305.
■Above figure:Shear strength -30/+80°C, Lower figure:Cross-Section after thermal cycle test
The only difference from SAC305 is "low cost"
A very small amount of two modifying elements Bi and Ni are added. Different effects from these elements achieved strong and easy-to-use low Ag solder that is equivalent to or superior to SAC305, such as the melting point, thermal resistance, and time-dependent change in the crystal structure.
Reflow profile of SAC305 applicable
The melting point of S1XBIG is 211-223°C. By adding KOKI's newly developed flux into the mix, the temperature profile of SAC305 has become applicable to S1XBIG. S1XBIG is a flexible solder paste which is low in Ag yet has workability as high as conventional products.
A Solution to Just About All Soldering Requirements
S1XBIG58-HF1100-3, by adopting newly developed techniques through our expertise and experiences, has gained excellent results
in all soldering features such as wetting, flux splattering, voiding, printing, tackiness, electrical reliability, halogen free, etc
Product Performance Table
- Product Name
- S1XBIG58-HF1100-3
- Product Category
- Solder Paste
- Composition
- Sn 1.1Ag 0.7Cu 1.8Bi + Ni
- Melting Point(℃)
- 211 - 223
- Particle Size（μm）
- 20 - 38
- Viscosity（Pa.s）
- 190
- Flux Content(%)
- 11.7
- Halide content(%)
- 0
- Flux Type
- ROL0 (IPC J-STD-004B / 004C )
