Hidden pillow phenomenon

2012.12.23

Using mobile telephones as a typical example, whilst downsizing of the electronic devices continues, more and more space saving components, such as BGAs and CSPs, are being widely used. It has become a critical issue that solder merging between the bumps and solder does not occur, and is referred to as ÅÉidden pillow defect¡¦under certain conditions. The solder paste S3X48-M406-3 has been developed to solve this difficult technical problem, not only for bumped components, such as BGA, but also for chip and leaded components.

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