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  • What's New
  • S3X70-G835, Micro-pattern Application Halogen Free Solder Paste. Applicable to 0402 chip component with AIR reflow atmosphere.
  • S3X58-CF100-2,Applicable for air reflow – crack free flux residue solder paste
  • SB6NX58-HF350,In-containing high reliability alloy halogen-free solder paste recommended for ENIG finish
  • Solder paste

    Solder Paste

  • Liquid Flux for Wave / Selective Soldering

    Liquid Flux for
    Wave / Selective
    Soldering

  • Tack flux

    Tack Flux

  • Flux cored solder wire

    Flux Cored
    Solder Wire

  • Heat Curable SMT Adhesive

    Heat Curable SMT Adhesive

  • for Power Device

    for Power Semiconductor Device

What's New

2022.04.25Exhibition & Event
Come join us at SMTconnect & PCIM Europe 2022 in Nuremberg!​
2022.03.31Corporate News
KOKI receiving IPC Distinguished Committee Service Award for the revision of IPC J-STD-004
2022.03.17Corporate News
Effect of the Fukushima Prefecture Offshore Earthquake on Mar. 16, 2022
2022.03.16Corporate News
Effect of lockdown in Shenzhen and Shanghai, China

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  • Solder Paste
  • Wave Solderling Flux
  • Tack Flux
  • Flux Cored Solder Wire
  • Heat Curable SMT Adhesive
  • for Power Semiconductor Device

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Technical Memo

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