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Halogen-free solder paste applicable to 0402 metric in air reflow


KOKI Company Limited announces the release of a newly developed halogen free solder paste for micro-pattern application S3X70-G811, that can be reflowed in an air atmosphere.

 

S3X70-G811 adopts a newly engineered flux formulation optimized for Type 5 solder powder and enables air reflow soldering of 0402 metric size components with the following product features:


  • Excellent meltability and wettability at the micro-patterns in air reflow

Although the solder paste size of S3X70-G811 is Type 5, the product exhibits good meltability and wettability without a Nitrogen atmosphere. This has been enabled by a newly engineered flux formulation optimized for Type 5 powders.


  • Reduced stencil issues with the newly developed lubrication technique

S3X70-G811 adopts a type of non-volatile solvent as its primary constituent and can keep itself from drying when the paste is left idle. A better print-to-pause property results, ensuring a consistent printability and workability even after a 60-min. pause.


  • Reduced voids with various board surface finish treatments

In addition to having good melting properties, S3X70-G811 displays excellent wetting performance on various board surface finishes. This helps the molten solder to quickly push out flux elements and reduces the occurrence of voids as a result.


Check out the product page for more details.

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