Lead Free Solder Paste for Micro-pattern Applications

S3X811-M500-6
Sn 3.0Ag 0.5Cu

Preventing Solder Powder Degradation

Application of 0201/03015 Components and Future Projection

Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.

【 Trend of Ceramic Capacitor Sizes 】

Optimal Printability in Both Continuous and Intermittent Print at Fine Pitch

To achieve stable print at 0.1 mm aperture, Type 6 solder powder is selected.
Newly engineered solvent does not evaporate at room temperature thereby improving intermittent printability.

Stable Meltability Performance Based on Flux and Activator Design

【 Protect Solder Powder by Flux 】

Product Performance Table

Product Name
S3X811-M500-6
Product Category
Solder Paste
Composition
Sn 3.0Ag 0.5Cu
Melting Point(℃)
217-219
Particle Size（μm）
5-20
Viscosity（Pa.s）
200
Flux Content(%)
11.4
Halide content(%)
0
Flux Type
ROL0(IPC J-STD-004B)

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