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Lead Free Solder Paste for Micro-pattern Applications
S3X811-M500-6
Sn 3.0Ag 0.5Cu
![](/src/upload/main/2017/12/811_500_6_main.png)
Preventing Solder Powder Degradation
Application of 0201/03015 Components and Future Projection
Currently, application of 0201/03015 size components is limited to mobile devices such as a blue tooth or GPS module.
In the future, miniaturization of electric device is expected to accelerate and the demand for micro size components can be increased.
【 Trend of Ceramic Capacitor Sizes 】
![](/src/upload/item/2017/12/811_500_6_11.png)
Optimal Printability in Both Continuous and Intermittent Print at Fine Pitch
To achieve stable print at 0.1 mm aperture, Type 6 solder powder is selected.
Newly engineered solvent does not evaporate at room temperature thereby improving intermittent printability.
![](/src/upload/item/2017/12/811_500_6_31.png)
Stable Meltability Performance Based on Flux and Activator Design
【 Protect Solder Powder by Flux 】
![](/src/upload/item/2017/12/811_500_6_2.png)
Product Performance Table
- Product Name
- S3X811-M500-6
- Product Category
- Solder Paste
- Composition
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- 217-219
- Particle Size(μm)
- 5-20
- Viscosity(Pa.s)
- 200
- Flux Content(%)
- 11.4
- Halide content(%)
- 0
- Flux Type
- ROL0(IPC J-STD-004B)