True Halogen Free High Reliability Alloy Solder Paste

SB6N58-HF350
Sn 3.5Ag 0.5Bi 6.0In

Highly thermal stress resistant
Halogen free (ROL0) by IPC J-STD-004B

Increasing demand for high thermal stress

For PCBs exposed to severe temperature fluctuation,
long term durable alloys are required to counter thermal cycling induced stress.

■ Mechanism of crack occurrence by thermal cycling stress

Solid solution strengthening in Sn phase

Indium does not form compound with Sn but replace the Sn atom (from solid solution).
As atomic radius of In is significantly larger than Sn, it generates strain in atomic structure
and prevent Sn atom dislocation.

Activator technique enables viscosity stability,
powerful wetting, and high SIR

Product Performance Table

Product Name
SB6N58-HF350
Product Category
Solder Paste
Composition
Sn 3.5Ag 0.5Bi 6.0In
Melting Point(℃)
202-210
Particle Size（μm）
20 - 38
Viscosity（Pa.s）
200
Flux Content(%)
11.0
Halide content(%)
0
Flux Type
ROL0

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