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Mycronic-approved Solder Paste for Jet Dispensing
S3X70-E160DN
Sn 3.0Ag 0.5Cu
![](/src/upload/main/2017/08/e150dn_series_en_main_12.jpg)
Mycronic jetting machines
MY600 & MY700 applicable
Solder paste approved by Mycronic
Mycronic, a Swedish industrial machine manufacturer, has approved the use of S3X70-E160DN with their jetting machies MY600 and MY700.
For more information, please contact Koki or our distributor near you.
■ Mycronic MY700
![](/src/upload/item/2022/08/e160dn_1.png)
Excellent high speed jet dispensing performance
Thanks to the optimized size of solder powder and viscosity, and adjustment in thixotropy, S3X70-E160DN wipes out concerns with conventional jet dispensing solder paste such as clogging of needles.
Further, it prevents solder icicle and spattering even in high-speed jet dispensing.
![](/src/upload/item/2022/08/e160dn_2.png)
Halogen free according to BS EN 14582
S3X58-E160DN is categorized as halogen free according to BS EN 14582 (Cl + Br < 1500 ppm).
![](/src/upload/item/2016/09/S01XBIG58-M500-4_03.jpg)
Product Performance Table
- Product Name
- S3X70-E160DN
- Product Category
- Solder Paste
- Composition
- Sn 3.0Ag 0.5Cu
- Melting Point(℃)
- 217 - 219
- Particle Size(μm)
- 10 -25
- Viscosity(Pa.s)
- 80
- Flux Content(%)
- 15.0
- Halide content(%)
- 0
- Flux Type
- ROL0